Custom Integrated Capacitor Arrays: Miniaturization | Flexibility | Performance

High-density integrated thin film capacitors utilize a patented multi-layer production process to deliver custom capacitor solutions for size-critical applications.  A single chip can be designed to include multiple high-density  capacitors with integrated custom routing and fine-pitch I/O pads, saving board space and eliminating the need for surface-mount capacitor placements.  Flexible I/O placement enables simple die stacking, flip chip or wire bond packaging options.   Relative to discrete capacitors integrated capacitors offer superior performance advantages including excellent matching characteristics, stability over temperature, time and applied voltage, and the ability to locate high quality capacitance directly at critical nodes of the system thereby minimizing parasitic effects.

SiPArray and 3D Chip Stacking
Technology Provides Dramatic Size & Weight Reduction Benefits

SiPArray™ technology enables extreme miniaturization in 3D multi-chip packages. In typical assemblies, SiPArray™ offers 97% reduction in package size as compared to traditional SMT (surface mount technologies).

Application: SiPArray™ Integrated Passive Capacitor Chips used in a miniaturized 3D Chip Stacking Architecture (MCM)

The following case study illustrates the application of SiPArray Integrated Capacitor Chips (CAP 1 and CAP 2) into a 3D chip stacking architecture (hearing aid application) to achieve an extremely miniaturized S-CSP (Stacked Chip Scale Package). 

As presented in Figures 3, 4 and 5 below, highly sensitive analogue IC is flip-chipped on a SiPArray IC (CAP 1), and then wire-bonded to the main substrate; in effect acting as a Through Silicon Via. Similarly, another SiParray CAP2 is directly flip-chipped on the main substrate platform and thus minimizing routing in the assembly.

Beyond providing an integrated capacitor network the SiPArray™ capacitor chips also function as an integral part of the overall mechanical structure of these S-CSP architectures, providing additional high density signal routing planes and physical interposer layers.

SiPArray™ Technical Specifications

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For more information on custom designs and further passive integration possibilities please contact Sound Design Technology Services @ techservices@sounddes.com or call +1 (905) 635-0804 x1740