Assembly
Assembly capabilities include SMT (surface mount technology), flip chip, wire-bonding, encapsulation, and singulation. This spectrum of assembly capabilities enables Sound Design Technologies to produce simple single chip hybrids or complex stacked MCMs (multi chip modules), S-CSPs (stacked chip scale packages), SiPs (system in package).
SMT:
- Single / double sided placement components as small as 0201 multiple solder types and/or adhesives.
Bare Die Attach:
- Bare die from waffle pack or tape.
Flip Chip:
- High volume / high precision / down to 200um [0.008"] pitch.
Wirebond:
- Gold thermosonic ball bonding.
Encapsulation:
- Automated flooding, glob top, under-filling.
Marking:
- Laser marking of product traceability codes.
Singulation:
- Precision dicing of ceramic / encapsulated parts.
Test:
Engineering Support:
- Skilled design group supported by experienced process engineers.
